• Memory
  • By Sebastian Pop
  • April 11th, 2012
Invensas Creates Special Ultrabook Memory

Invensas Creates Special Ultrabook Memory

Behold the DIMM-IN-A-PACKAGE multi-die face-down (xFD) technology

  • Memory
  • By Sebastian Pop
  • September 6th, 2011
Invensas Makes DRAM More Capacious and Cheaper

Invensas Makes DRAM More Capacious and Cheaper

New packaging technology brings quite a few benefits