- Memory
- By Sebastian Pop
- December 6th, 2011
Intel and ITRI Plan Super-Efficient and Fast Memory
They want to change how CPUs and memory communicate too
- CPU
- By Sorin Nita
- September 7th, 2011
IBM and 3M Plan to Develop New Adhesives for 3D Semiconductors
For creating processors up to 1,000 times faster than today's CPUs
- Sci Pry
- By Tudor Vieru
- March 18th, 2009
Nanorods Facilitate the Construction of 3D Chips
A new technique to build them has been devised
- Memory
- By Traian Teglet
- June 20th, 2008
Toshiba and SanDisk Team up to Bring 3D Memory on the Market
The combined power of both companies could change the memory industry
- CPU
- By Traian Teglet
- June 6th, 2008
IBM Enables Water-Cooling for 3D Chips
Tackling one of the most significant issues with 3D chips design