No malicious hardware found by customers, US agencies either

Dec 11, 2018 19:19 GMT  ·  By

Supermicro launched an investigation to see if any malicious chips were indeed added on its server motherboards as reported by Bloomberg at the start of October 2018 and the results were negative.

"After thorough examination and a range of functional tests, the investigations firm found absolutely no evidence of malicious hardware on our motherboards," stated Supermicro in its press release.

The audit was conducted by a third-party investigations firm hired by Supermicro to eliminate any suspicions of bias and to prove beyond doubt that their products were not in any way compromised throughout the supply chain as Bloomberg outlined in their report.

The analysis used a collection of representative sample motherboard models including recently released motherboard models, as well as the model affected by the supply chain hardware hack mentioned by Bloomberg in its article.

"We appreciate the industry support regarding this matter from many of our customers, like Apple and AWS," also said Supermicro.

Supermicro also detailed the safeguard measures it uses to ensure its products are not compromised

The company added that "We are also grateful for numerous senior government officials, including representatives of the Department of Homeland Security, the Director of National Intelligence, and the Director of the FBI, who early on appropriately questioned the truth of the media reports."

In support of their findings, Supermicro stated that they have never been informed about malicious hardware being found in their products by any U.S. government agencies.

Furthermore, Supermicro failed to ever discover any proof of maliciously added chips or similar hardware in their server motherboard nor did their customers until Bloomberg's report or after.

The information tech company also said in its press release addressing Bloomberg's October report that it continuously tests every motherboard it manufactures against their design to detect any defects or aberrations that could appear during the assembling process.