14 DAY TRIAL // It looks like Motorola plans a very special Moto X (4th Generation) smartphone next year and it's not the outside of the phone that we should be looking for.
A new picture of the smartphone's chassis leaked recently directly from China. Obviously, there's no telling whether or not the component captured in the photo belongs to the Moto X (4th Generation).
However, what's interesting about this picture is the fact that the chassis features a heat pipe for cooling. This solution has already been adopted by Microsoft and Sony Mobile for their Lumia 950 XL and Xperia Z5 Premium smartphones.
As many of you probably know by now, these two flagship smartphones are powered by Qualcomm Snapdragon 810 processor, which had some overheating issues in the beginning. The heat pipe is meant to control the overheating of such chipsets.
Still, that's rather curious since we had expected Motorola to include a different chipset inside the Moto X (4th Gen) like the new Snapdragon 820.
Unibody design, metal body
We haven't heard anything about Qualcomm's Snapdragon 820 chipset having the same overheating issues as the predecessor model, but it looks like Motorola wants to be prepared for every possible scenario.
Motorola Moto X (4th Gen) should feature a unibody design, but we can't really tell from the chassis shown in the picture.
We do see that slots for the two front and back cameras, but aside from that there's nothing really new that we can learn from this picture.
Obviously, it's a bit too early to talk about specs, but as mentioned above, we expect the Moto X (4th Gen) will come equipped with a Qualcomm Snapdragon 820 processor inside and at least 3GB of RAM.
Also, let's not forget that this picture might have been taken from an early prototype, so much can change in the next couple of months.