The flagship handset will be announced later today

Jan 5, 2016 03:07 GMT  ·  By

Chinese company LeTV has just teased its next flagship smartphone, the Max Pro. The device will be officially introduced on January 5, and it's likely to be showcased at CES 2016 trade fair in Las Vegas.

The smartphone has been teased by the company's VP and the image gives us the first clue on what LeTV plans to announce later today.

The smartphone's keypad showing in the teaser has the keys 2, 8 and 0 pressed, which is why we believe LeTV hints at a device powered by Qualcomm's Snapdragon 820 chipset, GadgetzArena reports. The only device that could pack such a powerful processor is the unannounced LeTV Max Pro.

Aside from the fact that it will be powered by a Qualcomm Snapdragon 820 CPU, the Chinese company did not reveal anything else about its upcoming flagship smartphone.

The good news is the rumor mill has already confirmed the smartphone will boast a larger 5.5-inch capacitive touchscreen display that supports Quad HD (2560 x 1440 pixels resolution).

Also, the smartphone will pack no less than 4GB of RAM and 64GB of internal memory. There's no mention of microSD card slot, so we must until LeTV's official announcement to get it confirmed.

Awesome 21MP rear camera and 3,400 mAh battery inside

At the back, LeTV Max Pro should feature an impressive 21-megapixel camera with autofocus, LED flash and 4K video recording while in the front the smartphone has been tipped to pack a 4-UltraPixel camera for selfies and video calls.

Furthermore, the Max Pro will come with a fingerprint sensor that will feature Qualcomm Snapdragon Sense technology.

The last piece of information on LeTV's flagship is the fact that it will be powered by a large non-removable 3,400 mAh battery.

Keep in mind that these specs have been leaked via GFXBench database, so they have not been confirmed by the Chinese company yet. Stay tuned for more on this one.