Nov 26, 2010 09:58 GMT  ·  By

South Korean mobile phone maker Samsung Electronics has added a series of new languages to the list of those which are supported in its new bada SDK v1.2.0b1. Made available for download only recently, the new software solution comes with a nice range of new features when compared to the previous release.

First of all, we should note that the bada SDK 1.2 now offers support for Chinese, South East Asian and Middle East Asian languages, and that there are some more language packs made available for download for developers.

There are four different language packs made available for download along with the bada SDK installer, offering support for various languages developers would like to target with their applications. All the necessary files can be found via the download link at the bottom of this article.

As for the SDK itself, we should note that a nice range of new features were added with the new release, some of which can be seen detailed in the video embedded below.

According to Samsung, some of the most important such features would include:

Web app model and Flash app model

   1. HTML/JavaScript or Flash SWF can be native apps without C++ coding.

Conditional app launch

   1. bada can launch an application at a specific time.     2. bada can launch an application when the phone is connected by USB cable to a PC and a specific application is running on the PC. Open GL/ES 1.1, 1.2 Extension (PowerVR)     1. For more powerful and lively 3D support, we have strengthened the Open GL/ES Extension.

Wi-Fi EAP

   1. By supporting EAP that is widely used for business applications, more secure enterprise applications can be developed on bada platform.

Memory leak detector

   1. bada now supports memory leak checking, new&delete pair checking, and memory usage profiling.

However, the actual chnagelog for the new bada SDK v1.2.0b1 is longer than that. All the necessary info, as well as the download links for the SDK installer and the language packs can be found on Softpedia here.