14 DAY TRIAL // The SuperSpeed USB 3.0 interface is already making waves on the IT market, but it isn't progressing all that quickly, in terms of adoption, because none of Intel's or AMD's chipsets natively support it. Furthermore, neither CPU maker has any intention of adding such a feature to their next generation of core-logic sets. This, at least, is what was implied by previous leaks and reports, but a more recent one suggests that Advanced Micro Devices actually does have an USB 3.0-ready chipset on the way.
As consumers well know, the next big thing, so to speak, that AMD will deliver is the Fusion architecture, which has both the CPU and the GPU on the same die. Fudzilla now reports that one of these chipsets, the highest-end one to be precise, actually will allow motherboard makers to implement a few USB 3.0 connectors. This chipset is codenamed Hudson, will support Llano APUs (accelerated processing units) and will also be available in a second iteration, without SuperSpeed capabilities.
Hudson will only be compatible with the Fusion chips that integrate most, if not all, the functions usually provided by a motherboard's Northbridge. Essentially, this means that the platform itself will act as little more than a Southbridge chip.
The same report has some information on the rest of the core-logic range that the Sunnyvale, California-based company is readying. Enthusiasts, for instance, will be serviced by the so-called Scorpius platform, slated to be paired with Bulldozer central processors. This will only happen sometime next year.
Additionally, the Lynx platform will cater to the higher part of the mainstream, the so-called performance market. Finally, the value Fusion chips will do without USB 3.0, will succeed the Dorado/Kodiak Athlon II parts and will be coupled with the Brazos platform.