14 DAY TRIAL // All computer enthusiasts out there should mark November 17, 2008 date in their calendars, as this day will be quite important for the future of computing technology. Aside from Intel unveiling probably one of its highest-end central processing units, the Nehalem-based Core i7, the next-generation USB specifications are slated to be introduced on that exact same date. Basically, the things that will be officially unveiled on this year’s November 17 will be at the basis of most of the upcoming computer systems and computer devices.
You might think that the unveiling of the Core i7 processors is actually everything you have been waiting for, but the next-generation USB 3.0 specifications are also to be considered of significant importance. This happens because mainly all of the upcoming electronic or computer devices are bound to use this standard, which is said and expected to deliver up to 10 times the speed of today’s USB 2.0, used in almost every computer to have been released in the last 5 years or so.
According to CNet News, citing a statement on the part of the USB Implementers Forum released Wednesday, on November 17, USB-UF is going to host the SuperSpeed USB Developers Conference in San Jose, California. It is here that the specifications of the USB 3.0 standard are expected to be unveiled to the industry. This next-generation high-speed connection standard is now due for next year, and should be integrated in all upcoming PCs. It is said to bring a connection speed of roughly 5Gb/s.
Companies that have worked on the development of the SuperSpeed USB include major names such as Hewlett-Packard, Intel, NEC, NXP Semiconductors, Microsoft, and Texas Instruments. Earlier this year, Intel, on one hand, and NVIDIA and AMD on the other, have engaged in a quarrel involving claims of Intel not sharing the specifications of the USB 3.0 standard with the other two chip makers. At this time, reports have it that these disputes have come to an end.