UMC ready to migrate to 45nm manufacturing process

Nov 21, 2006 09:54 GMT  ·  By

UNITED MICROELECTRONICS says that they have successfully adopted the 45nm manufacturing process and that they have also produced the first 45nm SRAM samples. The products are fully functional and they will be introduced into the market in 2007 in order to replace 65nm parts.

The 45nm SRAM's were made using a sophisticated immersion lithography process for its 12 critical layers. Immersion lithography sticks a liquid between the scanner optics and the surface of the wafer and by that it replaces the traditional air gap. This improves the optical resolution because the immersion fluid has a higher refractive index than air and as a result it allows the process of fabrication to run smooth.

UMC said that the development of 45nm chips will prepare the adoption of this new technology and it will also allow the number of SRAM chips per wafer to increase. Expected prices of the new 45nm ICs are unknown.