14 DAY TRIAL // Qualcomm's Snapdragon 810 chipset is extremely controversial, and some handset makers avoided putting in their flagship smartphones at the last moment.
The word is that the chipset overheats if the processor's speed isn't throttled down. The same happened with HTC One M9, which was proved to overheat when running pre-release software.
However, according to many users who bought the phone, the situation changed once the final version of the One M9 hit shelves, as benchmarks proved that the Snapdragon 810 did not overheat anymore.
It appears that HTC patched the One M9's software with some improvements to the thermal management of the chipset, which is why there were no issues reported with the retail versions of the smartphone.
But it looks like the overheating issues are prevalent in the updated version of Snapdragon 810 chipset, which has been recently released by Qualcomm.
The revised Snapdragon 810 v2.1 is now included inside Sony's Xperia Z3+, and judging from the video shot by the folks over at Btekt, it seems that the overheating issues are still there.
Chipset overheats even when not using benchmarks
The bad news is that the Xperia Z3+ frequently produced warning messages that informed the user that the camera would be turned off temporarily to cool down.
These messages were only produced when the camera was used, but the chipset would overheat when running benchmarks as well.
But there is some good news too. It appears that the Xperia Z3+ unit used by Btekt in the video below is a prototype. As such, the smartphone does not have the final version of the software installed.
Hopefully, Sony will be able to offer a software update that will bring the much-needed thermal management improvements to the Snapdragon 810 v2.1 chipset inside the Xperia Z3+.
It's also worth mentioning that the Xperia Z4 Tablet will be packed with a similar chipset, which is probably one of the reasons the tablet's release was pushed to the end of June.
