14 DAY TRIAL // After announcing at the end of last month that it has started mass producing 32GB memory modules based on the 30nm fabrication node, Samsung has now informed us that the company is getting ready to roll out the first consumer memory solutions to utilize its advanced 30nm-class DDR3 DRAM chips.
The memory line that Samsung is preparing to unveil will include very low profile (VLP) UDIMMs for desktop PCs and SO-DIMMs for notebooks.
These will be available as both standalone DDR3 modules, with 2GB and 4GB capacities, or in a kit form for providing 4GB or 8GB memory upgrades to DIY users.
Their clock speeds will be rated at 1600MHz, but no information regarding the timings these work at are available at this point.
According to Samsung, its new 30nm memory chips use up to two-thirds less energy than those manufactured with the industry-standard 60nm-class technology.
“Replacing your DRAM can be one of the easiest, most cost-effective ways to upgrade your PC’s performance, and these new products offer the most energy-efficient option currently available to consumers,” said Reid Sullivan, senior vice president of mobile entertainment marketing, Samsung Electronics America.
“Samsung is committed to bringing performance-enhanced computing to consumers, and our 30nm-class process technology offers an outstanding combination of advanced low-power DDR3 technology, with blazing speed up to 1,600 megabits per second (Mbps),” concluded the company's rep.
Samsung’s new 30nm-class DDR3 DRAM modules will be available in the U.S. through numerous online and retail suppliers, including Amazon, Fry’s, Micro Center, Newegg and TigerDirect.
Estimated street prices for single pack modules will range from less than $30 to $55, while dual pack modules will range from $55 to $110.
Other memory manufacturers are also expected to purchase 30nm DDR3 memory from Samsung and release their own solutions based on these chips.