14 DAY TRIAL // Samsung Electronics is proud to announce that it has completed the development of industry's first thermally-enhanced chip-on-film (TECOF) package. This new technology is compatible with the IC (DDI) display driver, which is usually integrated in large-screen, high-resolution LCD displays. The enhanced DDI package improves thermal heat dissipation by 20 percent over the previous COF package, allowing the DDI to last longer and operate with greater reliability. The TECOF technology is said to also improve full-high-definition performance for + 40? displays.
All former DDI technologies require at least 15 volts of power in order to reproduce near-flawless high-speed video images. This process happens to generate greater heat, which can create reliability problems. Now, Samsung has developed an improved material for the mandatory thin metal tape component that has the optimal properties for effectively maximizing heat dissipation. The Korean company has also developed a new automated process for attaching the metal tape to the COF package. When using the enhanced TECOF package, thermal emissions from the DDI are quickly released through the included metal tape, minimizing heat buildup.
?Package technology has become an important element, along with circuit design, in the development of DDIs for large-screen LCD TVs,? said Sa yoon Kang, vice president for Samsung's System LSI Division. ?With the development of TECOF package, we propose the new standard for DDI product and solidify our global leadership position in developing display driver ICs for the LCD market .?
Samsung reports that it has already completed reliability tests for the new TECOF package and is expecting to ship its TECOF-enhanced DDI packages in the 2nd quarter of 2007.