14 DAY TRIAL // Less than three months ago South Korean mobile phone maker Samsung brought to the market a new Android-based flagship device, the Samsung GALAXY S II, which already sold millions of units, and is expected to sell millions more.
The new handset has just been torn to pieces, so that users can have a better look at what makes the new handset so special.
Two teardowns are available at the moment, one from the popular website iFixit, and another coming from Samsung themselves.
With over 3 million units sold in less than 55 days, the GALAXY S II is set to become one of the fastest selling handsets on the market, and demand for it is expected to increase even more.
It is not yet available for purchase on the United States market, but rumor has it that should not be too long before it lands on shelves in the country too.
Those who are waiting for it to be released and would like to learn some more info on what it would be capable of offering should have a look at the teardown images that are available from the two sources mentioned above.
What can be seen there includes the 4.3” Super AMOLED Plus display detached from the handset's body, as well as a closer look at the phone's 8.9mm body, and at its Main Circuit Board (Main Board).
The 1.2 Ghz Dual-Core chip that Samsung packed it with was brought to light as well, and the same applies to its HSPA+ 21 Mbps Modem chip, NFC (Near Field Communication) chips, or the 16GB Internal Memory it was packed with.
Moreover, the microSD memory card slot gets a closeup too, as well as the 8-megapixel photo snapper Galaxy S II sports on the back. The WiFi, Bluetooth, Accelerometer, Gyroscope and the like are being detailed as well, the same as the 1500mAh battery.