14 DAY TRIAL // South Korean maker Samsung Electronics announced on Monday the introduction of two new 1GHz application processors that are based on ARM's CORTEX-A8 solution. The two CPUs, namely S5PC110 and S5PV210, are aimed mainly at advanced mobile devices, and, while the former goes for small form-factor connected devices, including smartphones, the latter can fit perfectly inside netbooks, the company stated.
“More and more, user generated content currently accessed via the PC will be spread to mobile devices,” said Dr. Kwang Hyun Kim, senior vice president, strategic marketing team, System LSI Division, Samsung Electronics. “PC-level performance with lower power consumption will become mainstream requirements for advanced mobile devices. Samsung developed S5PC110 and S5PV210 application processors to satisfy these conflicting requirements to enable a new level of user experience not previously possible.”
The new application processors from Samsung are meant to deliver improved battery life, even when coupled with standard size batteries, as they boast low power technologies such as the 45-nanometer (nm) Low Power fabrication process. At the same time, Samsung also announced that the two solutions packed 32KB data and 32KB instruction caches, along with a 512KB L2 cache. Sporting 1GHz clock speeds and a large L2 cache, the new solutions can easily handle real-time applications, delivering an enhanced user experience and fast user interface responsiveness.
At the same time, the new S5PC110 and S5PV210 processors come with a built-in 3D graphics engine that enables support for 3D UI and high-caliber games. A 1080p full HD codec engine is also present with the two parts, delivering 30fps full HD video recording and playback. In addition, they also come with a built-in HDMI1.3 interface that enables the output of multimedia content to external displays. A high speed USB 2.0 host interface can also be added to their feature list.
“Targeted for small form factor mobile devices, the S5PC110 is housed in a 0.5mm pitch, 14X14mm2 FBGA package that allows package-on-package vertical stacking of low power, multiple chip package (MCP) memory such as OneDRAM, mobile DDR and LP DDR2, greatly reducing the overall foot print of the memory and processor combo. Designed for portable computing applications, the S5PV210 is packaged in a 0.65mm pitch, 17X17mm2 FBGA package with a high performance 2-channel 32-bit DDR2 memory interface that is essential for computing devices,” Samsung added.