14 DAY TRIAL // OCZ Technology Group, the worldwide leading provider of innovative, ultra-high performance and high reliability memory, announced today its Flex EX memory series, which is advertised as being able to deliver the impressive speeds any enthusiast is looking for. The new memory modules feature an updated compact form factor meant to maximize memory configurations on users’ motherboards.
The fresh premium high-density modules OCZ has unveiled are delivered in both DDR2 and DDR3 versions, and the speeds they provide allow them to run memory-intensive games and applications, while also offering improved thermal management for increased stability and performance on high-end gaming and overclocking systems.
The new Flex EX series is announced as one of the industry's fastest memory modules available today. They are able to fulfill the needs of any demanding enthusiast or gamer as they feature frequencies of up to DDR3-2000 and DDR2-1200, the fastest DDR2 4GB kit available. The fresh OCZ memory modules have been developed so as to deliver maximum of performance to any system.
“Memory is the primary storage device of any modern computer system and defines how fast the CPU can access data,” commented Dr. Michael Schuette, VP of Technology Development at OCZ Technology. “Density, frequency, and access latencies of the system memory are the critical factors for overall performance of any PC and that is where the new OCZ Flex Ex series sets new standards by providing the optimal combination of the three factors for any system architecture by offering unprecedented speed and latencies at 4GB density with advanced cooling options to enhance stability and performance in even the most demanding environments.”
The thermal management solution included in the OCZ Flex EX series is meant to enable high-frequency memory to operate at an optimal balance of extreme speeds and low latencies. The integrated liquid injection system that cools the memory modules is designed upon the OCZ Flex XLC (Xtreme Liquid Convection) Series. The new series has been developed with a “flexible” all-aluminum design, which offers users the choice of having the modules either water cooled or passively cooled through the array of aluminum fins. Moreover, users can also use both cooling solutions to maximize heat dissipation.
The new Flex EX modules feature optimizations for the latest cutting-edge platforms. The company announced that they would be available in 4GB (2x2048MB) dual channel kits. The Flex EX series is also backed by a Lifetime Warranty and industry-leading technical support.
The water or passive cooling Flex EX series will be initially available in the following versions:
OCZ PC2-9600 Flex EX 4GB (2x2GB) 1200MHz CL 6-6-6-18 @ 2.2V OCZ PC2-6400 Flex EX 4GB (2X2GB) 800MHz CL 4-4-3-15 @ 2.1V OCZ PC3-12800 Flex EX 4GB (2x2GB) 1600MHz CL 7-6-6-24 @ 1.9V OCZ PC3-16600 Flex EX 4GB (2x2GB) 2000MHz CL 8-8-8-30 @ 2.0V.
