14 DAY TRIAL // Micron Technology, Inc. has announced today that it started the sampling of industry’s highest-density all-in-one NAND-based multi-chip package (MCP). The new solution includes 16GB of multi-level cell (MLC) NAND and is targeted at mobile phones. The MCP is able to enhance the company's 32 gigabit (Gb) 34-nanometer (nm) MLC NAND technology, allowing it to reach the density in a single package.
The line between ultra-mobile PCs and the highly functional, full-featured smartphones is becoming thinner by the day, which drives handset makers into increasing both the storage capacity and the computing power of their devices, allowing this way for the integration of new features and applications. Given the fact that manufacturers need to keep a slim form factor, cutting-edge memory-stacking solutions could prove a great option, as they are able to offer high-density storage in a single package, directly on-board.
The new all-in-one MCP from Micron packs eight dies so as to deliver 16GBs of available on-board storage, eliminating this way the need of additional storage space. The device is able to offer up to 40 percent board-space savings in some models, allowing makers to capitalize on greater density while also delivering sleek handset designs.
The new 16GB all-in-one solution includes e-MMC memory, which combines NAND flash with a high-speed MultiMediaCard (MMC) controller meant to improve the overall system performance, and low-power DDR memory, as well as 2Gb single-level cell (SLC) NAND, meant to offer high reliability. Micron considers the combination a fortunate one, allowing manufacturers to deliver optimal storage and performance at the same time. Moreover, they will experience cost reductions, simplified design process and reduced time to market.
“We are encouraged by the shift happening within the mobile industry, bringing with it new opportunities for memory innovations,” said Eric Spanneut, director of mobile memory marketing for Micron. “Micron has taken great strides in expanding our mobile memory portfolio and we believe we are in a unique position with our 16GB-based all-in-one solution, empowering our customers to develop original handset designs.”
“High-density, on-board storage is a critical design element for PDA phone designs, and we are impressed with the path Micron is taking for its all-in-one MCP solutions,” said Dr Alex Sun, vice president at ASUSTeK Computer, Inc. “ASUS is recognized for innovation in bridging the phone and the Internet, and with the ability to easily increase storage capacity without having to sacrifice handset form factor or performance, we see great opportunity for these solutions in our next-generation models.”
Micron announced that the 16GB-based MCP solution is currently being sampled with select mobile phone designers and that it is expected to enter production in the first quarter of the year. At the same time, the company also announced the sampling of 4GB and 8GB densities for the all-in-one MCP solution, which are already ready for commercial production.