14 DAY TRIAL // Several reports recently issued show that Intel might be working on a new range of processors which will be launched in 2010, informs Daily Tech.
It appears that Intel's new processor will offer no less than eight processors, obviously four cores, 24MB of last-level LL cache, 'shared' between each of the eight processors, which will feature a 3MB of LL cache.
"With BBUL (a packaging method - e.n.), Intel removes top interconnect layer altogether. The processor core is actually embedded into the core layer with only its top surface exposed. The bottom interconnect layer is built-up, or "grown," from the processor core. One major limiting factor that BBUL eliminates is the need to use C4 bumps to connect the processor die to the packaging. As processors become more complex and contain more cores, more interconnects are required and as a result, C4 bumps are hitting their limit in terms of size and density. With the die embedded directly into the packaging," writes Daily Tech.
More precisely, the packaging layer contains other three layers developed from different materials. Consequently, the two external layers are made out of copper and the 'centered one' is entirely made of plastic. The core layer has several holes made by lasers, which have been then filled up with copper, and the elements which connect the processor to the mainboard's socket are appended to the bottom of the centered layer.
"Along with such technologies like extreme-ultraviolet (EUV) lithography, smaller silicon gates, better interconnects, BBUL, High-K gate dielectric and better processor designs, multi-core processors are quickly becoming more mainstream. While 32-core processors are still a few years away, Intel will be introducing Kentsfield, its first quad-core processor early in 2007. Likewise, AMD will also be introducing quad-core Opteron "rev. G" processors in the same time frame," concludes Daily Tech.