14 DAY TRIAL // European nanoelectronics research institute IMEC has recently stated that it plans to have a dedicated 450-mm wafer clean room available by 2015, as the organization believes this is when the the first extreme ultra-violet lithography system able to run 450-mm diameter wafers will be available.
"We want to continue to do leading-edge, R&D so must make a timely transition to 450-mm, 18-inch wafers in the next few years," said Luc van den Hove, president and CEO of IMEC, during a press event that recently took place at the institute's headquarters.
The organization's CEO continued by outlining the timeline for the 450 wafer technology, the first step being established in 2012 with 450-mm wafer tool and metrology testing.
Development of the 450mm process will continue between about 2013 and 2016, while the latter year will also mark the start of advanced production using this technology.
Van den Hove continued by adding that getting the timing for this technology right is crucial. "There is no sense in doing R&D too early as it would create excessive cost."
IMEC president is however confident that 450-mm diameter wafer transition is going to happen, as the recent announcement of the Global 450 Consortium, comprised of five leading chip companies (Intel, IBM, Samsung, TSMC and Globalfoundries), is a clear sign of this trend.
IMEC would take a two-phase approach to the transition to 450mm wafers, the early work (until 2015 or so) following to be done in its present 300-mm wafer fab which was deliberately made 450-mm compatible in terms of certain specifications such as ceiling height.
This first stage will mostly cover early metrology and process elements, wafer characterizations of stain, uniformity and performance, according to EETimes.
The second stage of this transition is where all the magic happens and requires the ability to hook up machines in a full-flow for process and device development in an environment similar to that used for mass production.
According to van den Hove, the 450mm fab extension should be started before 2015 in order to be finished just in time to receive the 450-mm wafer capable tools including EUV (extreme ultra-violet) lithography.