14 DAY TRIAL // Technologies are always advancing and the processes on which semiconductors are manufactured are periodically moving on to more advanced nodes. On the NAND Flash memory front, Hynix recently started experimenting with the 20nm manufacturing process technology and even developed a high-capacity chip based on it. Now, the same South Korean outfit has announced that it has finally started mass producing the 64 Gb NAND Flash chip.
The company reached this 20nm node back in February and has since been preparing to truly get even deeper into the thick of the storage market. Compared to 3xnm technologies, according to Hynix, moving on to 2xnm processes allows productivity to increase by 60 percent. It also allows for the making of higher-capacity and more affordable NAND for devices like solid state drives and smartphones, among other things. Mostly, the company will use these 64 Gb chips to provide high-performance, customized products in a timely fashion.
"Hynix decided to mass produce the industry's highest density 64Gb chips using 20nm class technology in order to fully satisfy demand from the customers. With these 20nm class 64Gb chips, the Company is enabled to provide customized, high performance products in a timely manner which perfectly suits mobile solutions including smartphones, table PCs and others," said Dr. S.W. Park, Executive Vice President and Chief Technology Officer of Hynix.
Hynix's 20nm 64 Gb NAND is being manufactured at the 300mm M11 fab in Cheo ngju and boasts both a higher operational speed as well as better reliability. Actual products based on it should go on sale before the ongoing year is out and should be more capacious and affordable than what is currently on the market. By means of this higher density and cost efficiency, the chip maker will “respond to the needs of advanced mobile solutions which require smaller size and higher density storage capacity.”