14 DAY TRIAL // ADATA has introduced the latest range of high-end random access memory modules and kits, and described them in a rather peculiar fashion. They are called the XPG V2.
Long story short, the ADATA XPG V2 are made for 3rd Generation Intel Core Processors and the Z87 platform.
We say this choice of words is odd because Z87 motherboards are made for LGA1150 Haswell CPUs, the fourth generation, while the third generation of Intel Core-series chips is the current Ivy Bridge range.
Then again, the memory will work on motherboards made for both types of CPUs, so this is, fortunately, a non-issue.
The XPG V2 modules have 2oz copper, 8 layer PCBs (Printed Circuit Boards) and aluminum heat spreaders with Thermal Conductive Technology (TCT).
They also operate at 2800 MHz, on timings (latencies) of CL 12-14-14-36 at 1.65 volts.
The frequency is very high, seeing how DDR3-1600 is considered standard nowadays, and that even DDR3-1333 is acceptable in most cases, provided the capacity is decent.
At this rate, there won't be much of a clock speed difference between DDR3 and DDR4 when the latter standard makes its debut.
But we digress. The aluminum heatspreaders are colorful and intricate in shape. The form has a double purpose.
One is, obviously, to instill a measure of aesthetic appreciation in the eyes of beholders. At least during the time between the removal from the package and the moment the modules are inserted in the slots and shut in the desktop case, never to be seen again (unless a side window exists, and sometimes not even then).
The other is to maximize the heat dissipation capabilities of the metal plates. There are even hollow indentations that let the fins breathe.
Sales of the ADATA XPG V2 should start soon, in 8 GB and 16 GB capacities (kits of two 4 GB and two 8 GB modules, respectively). Prices haven't been disclosed.
