14 DAY TRIAL // Globalfoundries has just announced that its newly constructed cleanrooms in New York and Dresden are ready for the installation of 300mm semiconductor wafer fabrication equipment, a status that marks the transition from the construction phase to the operations phase.
At Fab 1 in Dresden, Germany, the foundry has completed construction of an additional wafer manufacturing facility designed to add capacity for 45nm and below.
This has the potential to increase the overall output of the Fab 1 campus to 80,000 wafers per month once fully ramped and will add more than 110,000 square feet of cleanroom space to the site, making Dresden the largest wafer fab in Europe for leading-edge technology.
Meanwhile, at the Fab 8 campus, that is still under construction in Saratoga County, New York, the company said it moved into the Admin 1 office building and broke ground on the Admin 2 building last week.
The facility is expected to come online in 2012 with volume production targeted for early 2013 and will manufacture chips using the 28nm node and below.
Once completed, Fab 8 will include approximately 300,000 square feet of cleanroom space and will be capable of delivering a total output of approximately 60,000 wafers per month.
“At Globalfoundries , we continue to invest aggressively in driving sustained growth on advanced technologies,” said Globalfoundries CEO Ajit Manocha.
“The build-out of our 300mm manufacturing campuses in New York and Dresden is supporting growing customer demand for advanced technologies, while creating hundreds of jobs and providing a significant boost to the economies in the surrounding regions.
“By completing these massive construction projects on schedule and on budget, we are continuing to deliver on our commitment to being the only truly global foundry,” concluded the company's rep.
This announcement comes about one year after the foundry revealed its plans for a major global capacity expansion.