14 DAY TRIAL // Micron has begun to ship what might just be the greatest advancement in memory technology of the past half a decade, if not longer: HMC.
Obviously, HMC stands for Hybrid Memory Cube, where advanced through-silicon vias (TSVs)-vertical conduits are used, to electrically connect a stack of individual chips.
Thus, high-performance logic is combined with Micron high-end DRAM.
And with each of those four DRAM dies featuring 4 GB in capacity, that leads to a total of 2 GB per chip. Not bad for something with 160 GB/s memory bandwidth for 70% less energy per bit than alternative technologies.
Micron hopes to finish 4 GB engineering samples by early 2014, but mass production for both 4 GB and 2 GB chips will be held off until the second part of that year. Alas.