Following a strategic agreement

Jul 27, 2007 12:53 GMT  ·  By

Ericsson and Texas Instruments, the world leader in silicon solutions for wireless communications, have announced an agreement to form a strategic technology engagement in order to produce custom solutions for Open OS enabled 3G handhelds. This will help handheld producers to provide Open OS devices for the high-end market as well as for the mid-range one.

Texas Instruments' high-performance OMAP applications processors will be combined with the small and power-efficient 3G modems from Ericsson Mobile Platforms. The solutions resulted from the engagement will support all the major Open OS, providing easy access to a great number of different services and applications. Device manufacturers will be able to deliver new and captivating multimedia experiences and mobile entertainment for the continuously increasing needs that users all over the globe have.

The collaboration between the two companies will take advantage of Ericsson's Mobile Platforms IOT program, one of the most comprehensive interoperability testing processes available on the market, assuring maximum compliance with operator requirements.

The senior vice president of Texas Instruments' Wireless Terminals Business Unit, Greg Delagi, declared: "It's a tribute to the long-standing collaborative relationship between EMP and TI that we can tap into and combine each company's unique wireless expertise in order to deliver the most timely, targeted solutions to the market. TI's broad, proven product portfolio and advanced manufacturing capabilities have continued to adjust to the demanding requirements of EMP's customer base. We believe that today's announcement will build on what TI can bring to EMP and what both companies together can bring to this vital, dynamic industry."

"Ericsson is clear in its commitment to design and offer a portfolio of flexible, innovative mobile platforms that address the requirements of the rapidly evolving mobile device market. We are pleased to work closely with TI to combine the finest of each company's core wireless know-how - EMP's access technology and platform size leadership with TI's innovative OMAP application processors in order to provide the most capable Open OS platforms on the market today", said Robert Puskaric, head of Ericsson's mobile platforms' unit.

The new 3G solutions will be incorporated in devices available starting from the second half of 2008, so we have to wait until then to see how exactly this is going to change the mobile industry.