14 DAY TRIAL // According to a recent statement, Sunnyvale, California-based Advanced Micro Devices will expand its platform for ultra-thin portable computer systems with the introduction of more advanced processors and core-logic sets. The chip maker plans to start the shipments of these new products sometime in late Q2 2009, providing system vendors with an alternative to Intel's latest CULV platform for affordable ultra-thin portable computer systems. According to AMD, its upcoming platform, codenamed Congo, is a product that the company is proud of.
Robert Rivet, AMD's chief financial officer, said, during a conference call with financial analysts, that the chip maker planned to “start shipping Congo at the end of this quarter.” According to Rivet, the chip maker will have designs built on the new platform, which are expected to be shipped later this quarter.
The company's Congo platform is designed to provide support for the dual-core processing unit, codenamed Conesus, which will debut under the brand name of AMD Athlon Neo X2 processor. The new CPU will be paired with the AMD RS780M and SB780M chipset combo, enabling users with the processing power of a dual-core CPU and the ATI Radeon HD DirectX 10-capable graphics core. The solution is designed to power some of the upcoming ultra-thin portable computer systems that will likely build on the success of the current HP Pavilion dv2 laptop.
Despite no specific details that can provide a perspective on the performance of AMD's upcoming mobile processors and platform, the company said that the power consumption of its upcoming dual-core processors would not exceed that of the company's current single-core solutions. This could indicate that the new CPUs are manufactured using a 45nm process technology, although that is yet to be confirmed by the chip maker.
The company's CEO, Dirk Meyer said that the upcoming Congo platform would “extend the performance range affordable, ultra thin computing with the incorporation of dual-core CPUs and our 7-series chip sets.”