14 DAY TRIAL // Looks like Cooler Master is trying to live up to its name, having developed a new technology that promises to keep CPUs in line better than ever before.
What the company did was unveil the new Vertical Vapor Chamber technology, which has no airflow vortices and, thus, less than half the air resistance of normal finned heatskins.
There is also three times the normal fin area, meaning faster and more efficient heat dissipation than before.
The pictures that Cooler Master provided did not show any fans, but there will probably still be a need for at least one.
After all, the tech is supposed to cope with CPUs of up to 200W TDP (thermal design power).
The first commercially available Vertical Vapor Chamber cooler will be showcased at CeBIT, 2012. Go here for more info.