14 DAY TRIAL // Advanced Thermal Solutions has unveiled two new heatsink solutions, designed to work with Cavium Networks' OCTEON Plus CN56XX, OCTEON CN38XX and CN36XX multi-core MIPS64 processors. These heatsinks address especially the telecommunications and embedded computing environments.
The products, named ATS-691 and ATS-725 are alleged to maintain component case temperatures at or below the manufacturer's thermal specifications, which boosts the overall performance and improves the effective lifetime of the devices.
The ATS-691 model comes with a built-in blower fan, that makes it the ideal candidate in environments that completely or partially lack ventilation. The heatsink is completely made of copper with a high conductivity ratio and features multiple rows of thin fins that allow a forced airflow.
The massive copper ATS-691 heatsink has a thermal resistance of 0.60?C/W in an air flow of 200 ft/min (1 m/s), and the integrated fan can provide a constant airflow of up to 3.88 CFM. Sized 90 mm x 76 mm x 11 mm, the heatsink comes with a special phase changing thermal interface material as well as screw mounting hardware.
The other product in the line is the ATS-725 passive heat sink is designed to work in ventilated environments. It does not feature an active cooling solution, which qualifies it for usage in noiseless environments. The heatsink is made of light-weight, extruded aluminum with an anodized finish, with a thermal resistance of 2.0?C/W in an air velocity of 200 ft/min (1 m/s). The ATS-725 measures 40 mm x 40 x 20 mm and features maxiFLOW? flared fin architecture to maximize cooling surfaces.
The ATS-691 heatsink can be purchased for $24.00 in volume orders for the ATS-691, while the ATS-725 model only costs $6.00 in production quantities.