Besides DDR3 support, some of the boards will feature new southbridge characteristics

Jul 1, 2008 07:27 GMT  ·  By

The official AMD's motherboard chipset roadmap for 2009 has been revealed by the guys from ChileHardware, and we had a look at it. Some of the things showed here are not much of a surprise, the next-generation AMD motherboards will feature the latest technologies, including DDR3, on which we've already said a few words. Something that we didn't know much about is the pairing of the 780G chipset with the SB750 southbridge sometime during the third quarter this year.

The end of 2008 will bring us five motherboards from AMD, three of them situated in the discrete area, along with two IGP boards. SB750 will be present on three of them, including the 790FX and 780G. As for Q1 2009, we'll have a new version of 790FX featuring DDR3 support, since the RD790 is also the codename for 790FX. SB750 will continue to be used by AMD for this motherboard as well.

The second quarter of the next year will bring some rather interesting chipset developments, starting with the RD890 board, due for launch during that period of time, will have the already mentioned DDR3 support and will also bring the new SB800 southbridge. The same features, DDR3 and SB800, will also be present on the next IGP board, RS880, set for launch during the second quarter 2009 as well.

Unfortunately, we cannot offer more details on the characteristics of these future chipsets AMD has in store for us, besides the already known DDR3 support and the new southbridge feature, but we can say that the RS880 chipset will most likely have a more powerful graphics core. Besides, AMD might also end the line of chipsets with integrated graphics with this one, as we have learned that the company intends to move the graphics into the central processing unit sometime during 2009 and 2010.