14 DAY TRIAL // In times when mankind is beginning to leave behind the age of cooling mechanisms as loud as airplane engines, cooling technology is moving closer to noiselessness in the area of CPU fans. With the central processing units themselves evolving, each new cooler must make a compromise between the need for silence and the high number of rotations per minute required to keep the CPU temperature under control.
As opposed to a few years ago, when silent fans were exclusive to the high-end market, nowadays, better solutions are being developed even for the mid and low segments. The new cooling solution released by Taipei-based Xilence technologies, the 4ALL.R3, is aimed at a widespread use on these two lower areas.
The aptly dubbed cooling unit supports the Intel sockets LGA-775 and LGA-1156 and the AMD sockets AM2(+)/AM3. It is an entry-level unit designed as a replacement for stock-heatsinks. It is designed as a simple tower, with the CPU contact base (which doubles up as a small heatsink) using two copper heatpipes to convey heat to an aluminum fin block. The fins are cooled by a 92 mm fan.
The performance of the CPU can be compared with that of the Buffalo Evercool of the OCZ Vendetta (which has an extra three DCHP, compared with the 4ALL.R3, which only has two). Although they do not support the exact same array of central processing units (and, thus, will not be in any real competition), their performance and aim for the lower market segments are similar features.
Xilence's cooling solution will be available at prices around 20 EUR.
Xilence Technologies is a manufacturer of computer power supplies, fans, cases and cooling mechanisms for CPUs, GPUs and hard drives. Although its headquarters are located in Taipei (Taiwan), its production facility and branch office are in China, with two other branch offices located in North America and Germany.