14 DAY TRIAL // During the CeBIT show in Germany we managed to score some pictures of a Gigabyte P55-based motherboard, featuring Intel's next-generation Nehalem-supporting chipset. The showcased mobo was not yet finalized but provided us with a pretty general idea of some of the features of Intel's next-gen P55 chipset. It now appears that yet another motherboard maker, namely DFI, is close to finishing its design of the P55 motherboard. Fellows over at vr-zone managed to take some early pictures of the platform, which is also in its pre-release stages.
As some of you computer enthusiasts already know, the next-generation P55 chipset is meant to provide users with the computing power of Intel's Nehalem processors in a more affordable package. The new platform will sport a new socket, the LGA1156, which will likely be meant for Intel's highly rumored Core i5 processors. Aside from that, unlike the X58, the new P55 chipset offers support for dual-channel DDR3 memory, replacing the pricier triple-channel offering.
The DFI LANParty Dark P55 T3eH6 boasts 4 DDR3 memory DIMMs with support for dual-channel DDR3 memory, a 6+2 phase CPU power circuit, three PCI-Express x16 slots and six SATA II ports. Unfortunately, due to the fact that the board hasn't yet been finalized there's no cooling solution on the board. Also, when it will be released, the P55-based DFI LANParty board might come with some of the specifications modified.
The P55-based motherboards will provide support for the next-generation Intel-based mainstream computer systems. These systems will combine the latest DDR3 memory with Intel's Nehalem processors in a more affordable package. Currently Gigabyte and DFI appear to be the only motherboard makers that are close to finishing their P55-based design, at least from what we know from details that have been leaked on the Internet.