IBM and leading semiconductor manufacturers Chartered Semiconductor Manufacturing Ltd., GLOBALFOUNDRIES, Infineon Technologies, Samsung Electronics, Co., Ltd., and STMicroelectronics have jointly announced their plans to develop a 28nm high-k metal gate (HKMG), low-power CMOS process technology. The move is meant to ... |
17 April 2009
08:32 GMT |
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At the CeBIT 2009 show in Hanover, Gremany, the world's largest chip maker, Intel, talked about the next-generation 32-nanometer process technology, to which it expects to move this year, and also showcased its upcoming “Clarkdale” and “Arrandale” processors. According to Intel, the first... |
6 March 2009
02:39 GMT |
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With the two leading processor makers, Intel and AMD, now both ready to provide support for the next generation of DDR memory, DDR3 memory technology keeps improving, enabling higher levels of performance and better power consumption features. Just recently, Hynix Semiconductor announced that it had developed a 1GB (... |
9 February 2009
03:41 GMT |
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Intel Corporation has announced completing the development of the next-generation 32 nanometer manufacturing process, which would allow for the shrinking of the chips to a billionth of a meter. According to the company, the new fabrication technology will permit the chip maker to manufacture even more energy-efficien... |
10 December 2008
02:29 GMT |
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UMC announced yesterday having managed to reach a significant milestone with its high-k/metal-gate (HK/MG) technology related to the validation of the process through 45 nanometer SRAM product yield. The company considers this achievement as a first key-step in proving technology performance and process reliability f... |
26 November 2008
02:13 GMT |
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