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Intel Details Larrabee, Calpella and High-Performance SSDs Today is the last day of Intel's Developer Forum, the conference held in Los Angeles at the Moscone Center. As anticipated before it kicked off, Intel has revealed a number of details regarding upcoming products, including the soon-to-be-released Core i7 processors. The company has also detailed its highly antic...	21 August 2008 03:46 GMT

Intel's Calpella to Be Launched in Q3 2009 Although people are just getting used to Intel's latest mobile platform, the Centrino 2, the Santa Clara-based chip manufacturer is already planning ahead. The company is reported to be working on the development of their next-generation mobile platform, which follows the current one codenamed Montevina.Details ...	5 August 2008 10:52 GMT

IDF: Nehalem-Based Calpella Mobile Platform, Branded as Centrino 3 Intel has not yet finished introducing its upcoming Centrino 2 mobile platform, and details about the next one already started to pop out. According to Intel's Mobility Group General Manager Dadi Perlmutter, the other mobile platform will be codenamed Calpella and will be entirely based on the Nehalem micro-arch...	2 April 2008 10:35 GMT

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