Qualcomm Is Sampling Dual-carrier HSPA+ and Multi-Mode 3G/LTE Chipsets

Worldwide leading developer of advanced wireless technologies, Qualcomm Incorporated, recently announced that it has started the sampling of the world's first chipsets for dual-carrier HSPA+ and multi-mode 3G /LTE. According to the company, the new Mobile Data Modem (MDM) MDM8220 soluti... [ read more >> ]

Qualcomm announces the sampling of dual-carrier HSPA+ and multi-mode 3G/LTE chipsets

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Qualcomm announces the sampling of dual-carrier HSPA+ and multi-mode 3G/LTE chipsets