Talk, talk but can TSMC walk the walk? We'll see in 2018

Jul 22, 2015 07:40 GMT  ·  By

Treading in the footsteps of IBM who managed to break the 10nm process barrier by printing the first 7nm process semiconductor using EUV (Extreme-Ultraviolet Lithography), TSMC plans to go further using the same experimental process manufacturing technology.

Taiwan Semiconductor Manufacturing Co. isn't a complete stranger to EUV as it was planning to use the Ultraviolet Lithography for its 10nm process technology as well. Unfortunately such advanced scanning technology is out of reach for most, except IBM, semiconductor manufacturers, and building such scanning devices in large enough numbers with reliable results will take time and money.

Even IBM itself stated that, although the first 7nm process wafer had been produced, it would take much longer until such process technology became mainstream, implying as well that years of further development were needed. Since this harsh reality applies even to the most advanced companies in EUV lithography development, we can conclude that TSMC's announcement is made to encourage partners in dealing with the company on the long run, without any immediate results.

Across the industry, the general assumption is that anything that goes beyond 10nm will come at least in five years’ time so TSMC can't develop or deliver anything smaller than 10nm in the nearest future.

EUV scanners aren't easy to come by

EUV lithography is a cutting-edge process manufacturing technology that's currently under tests and further development by major semiconductor companies. It features lasers with 13.5nm wavelengths that will "draw" finer lines in the silicon or silicon-germanium chips, and it eliminates multi-patterning, will shrink cycle times and will help make better yields for the new chips.

However, EUV scanners aren't made for widespread commercial production and are already used in prototype design at IBM. ASML, a leading maker of semiconductor production equipment, is already working closely with TSMC as well to develop and fine-tune the EUV scanners for a future 5nm mass process manufacturing technology usage.

TSMC plans to begin its first 7nm fabrication process trials in 2017 - 2018, fine-tuning the scanners for a further 5nm manufacturing technology. TSMC is actually pushing forward the sub-10nm process technology quite fast compared with its competitors, probably to close the gap with IBM and take the process manufacturing lead. TSMC might be ready to compromise and cut corners to do so, and further manufacturing issues might occur if speed is more important than quality.

For now this is mostly talk and advertisement. 2018 is still three years away and TSMC's 20nm process technology isn't doing so well on Qualcomm's SoCs.