14 DAY TRIAL // Since "Cannonlake" was declared canceled, "Kaby Lake" is taking its place for 2016 release date. Intel's newest, still experimental, 10nm form factor CPU that will probably arrive on the market under the name of "Ice Lake," will be available in 2017.
The welcomed news, however, will be the introduction of the fully integrated voltage regulator (FIVR) in the future 10nm series.
All mainstream top-end CPUs from Intel, with the exception of "Haswell" and "Broadwell," rely on FIVRs locate on motherboards. On these two CPU series, however, the FIVR gives Intel enough autonomy to regulate voltage and power supply of its own CPUs without having to rely on mainboard manufacturers that have their own in-house power regulations. This way Intel makes sure there is an ideal power consumption for its CPUs.
Although "Skylake" and "Kaby Lake" will not feature FIVR Hardwareluxx believes that this feature will return in the 2017 "Ice Lake" 10nm series.
Similar but more powerful
The new groundbreaking 10nm die is still a mystery, but it is believed to have a micro-architecture similar with Skylake, only being much more powerful. It will also require a new socket, as it will not run on Skylake's LGA 1151. Some of the reasons for reintroducing the controversial FIVR is to prevent users from burning their own systems while trying to overclock the 10nm monster.
As we mentioned before, generally FIVR's are considered controversial as their use can prevent proper overclocking on the newest Haswell series that barely reach really powerful speeds, while the older Ivy Bridges can reliably reach extremely powerful speeds of even 4.9GHz.
Intel's solution to reintroduce the FIVR can seem a bit short-sighted as it will protect only systems on the launch date, which might not handle very well the new increased speed-per-density. However, the more systems and cooling solutions advance, the better they will able to handle the heat. This also seems to be a decision that Intel has made deliberately to have the socket that comes with the new CPU help dissipate the heat and power input towards other modules.
