14 DAY TRIAL // Meizu’s upcoming flagship smartphone could be the first to pack MediaTek’s newly announced Helio X25 processor. The chipset maker announced last year the powerful Helio X20 deca-core processor, which has yet to make its debut on the market.
Although the Helio X20 hasn’t yet been released, MediaTek announced last week another, more powerful chipset, the Helio X25. The latter is the upgraded version of the former in the fact that its cores are clocked at 2.5GHz instead of 2.3GHz.
Also, the Mali-T880 graphics processing unit included on the SoC will be clocked higher at 850MHz, which is why the Helio X25 will be faster in games.
According to the listing at GFXBench, Meizu Pro 6 will come equipped with a deca-core Helio X25 processor clocked at 2.5GHz, a Mali-T880 graphics processing unit and 4GB of RAM.
Details about RAM and display are a bit confusing
The prototype unit tested in GFXBenchmark does not report the correct amount of RAM inside the Meizu Pro 6, and the same goes for the size of the screen.
Even though rumor has it that Meizu Pro 6 should sport a 5.7-inch Quad HD capacitive touchscreen display, GFXBench reports the smartphone packs a much smaller 4.6-inch full HD (1080p) screen.
The good news is the benchmark confirms the smartphone will boast an impressive 21-megapixel photo snapper on the back, which features autofocus, LED flash and 4K video recording, as well as a 5-megapixel camera in the front.
Another piece of information that we’ve learned from this leak is that fact that Meizu Pro 6 will pack 32GB of internal memory and it will ship with Android 6.0 Marshmallow operating system right out of the box.
There’s no word on price and availability yet, but since the smartphone has already appeared in benchmarks, we expect it to go official in the next couple of weeks.
