TSMC will use a 7-nanometer design for the new chips

May 23, 2018 09:00 GMT  ·  By

Production of A12 chips for Apple’s 2018 iPhone trio has already started at TSMC, and for this generation, the company will finally make the transition from the 10-nanometer design on the current models to 7-nanometer.

This new processor design will allow for substantial improvements in terms of performance, and at the same time, help Apple gain more space under the hood.

Cupertino has turned to several design changes in the last iPhone generations to use the space inside in a more effective manner and allow for the use of new technology, and the removal of the headphone jack is one of them.

Bloomberg also reports that Apple would launch three different iPhone models this year, including a more affordable configuration and a Plus-sized iPhone X with a 6.5-inch OLED panel. The low-cost iPhone would come with an LCD display likely to measure 6.1 inches and lack several high-end features, though for the time being the exact spec sheet is not yet available.

New iPhones coming in September

All devices are projected to launch in September, and Apple hopes that by starting parts manufacturing early, it can avoid production issues like the ones that impacted the release of iPhone X last year.

Apple announced the anniversary iPhone in September, but sales only started in early November due to a delay caused by production struggles and low yield rates. Face ID was the one to blame, as the high complexity of the facial recognition system did not allow suppliers to reach maximum capacity, instead trying to meet Apple’s required accuracy.

This year, all iPhone models would feature Face ID and give up on the fingerprint sensor. A notch is thus very likely to make it to the 2018 lineup, regardless of the type of display being used. This means the low-cost model would boast Face ID and a notch too, with an edge-to-edge screen very likely.