14 DAY TRIAL // We reported a few days ago that LG plans to launch a “super premium phone” later this year, but also multiple G4 variants.
The South Korean company is now trying to find a timeframe for the release of its next high-end smartphone, in order to avoid competing with other flagships like Microsoft's Lumia smartphones, Apple's iPhone 6s or Samsung's Galaxy Note 5.
But until then, here is a rumor coming from China, which claims LG has already set the specs that will include in the third LG G Flex smartphone, which is expected to arrive sometime in March 2016.
We're still several months away from the potential unveiling of the top tier smartphone, but the details provided by the unnamed source make sense if we take into consideration the upcoming technologies that should be available by the time LG G Flex 3 should be released on the market.
In this regard, the G Flex 3 has been tipped to be powered by Qualcomm's not-yet-released Snapdragon 820 chipset, which should be one of the most powerful chipsets on the market.
Hopefully, the SoC (system-on-chip) won't have the same overheating issues as the Snapdragon 810, which is now embedded in many flagship smartphones.
4GB RAM and flexible display
Apart from the Snapdragon 820 CPU, LG G Flex 3 is expected to boast a huge 6-inch capacitive touchscreen display that should support Quad HD (2560 x 1440 pixels) resolution. Obviously, just like the predecessors, this one will feature a flexible display.
Also, the device will pack 4GB of RAM and 32GB of storage with microSD expansion support up to 128GB. On the back, there will be a 20.7-megapixel photo snapper, while in the front LG G Flex 3 will feature a no less impressive 8-megapixel camera for selfies and video calls.
Last but not least, LG G Flex 3 is said to house a fingerprint scanner in the power button for enhanced security, and it will drain energy from a battery of at least 3,500 mAh.
By the time it gets released, it will probably ship with Android M, or whatever the name, right out of the box.