Component suppliers who are partners with Cupertino, California-based Apple have reportedly leaked new information surrounding the next generation of iPhones that are expected to drop this September.
According to Apple’s partners, the fifth iPhone Apple is preparing to launch (whether it’s dubbed iPhone 5, iPhone 4S, or anything else for that matter) reportedly has a thinner enclosure.
The phone is not only slimmer but lighter too, compared to the current iPhone 4, reports say.
It will pack an 8-megapixel camera according to these industry sources, and at least one person with knowledge of the situation said the new iPhone will pack a Qualcomm wireless baseband chip.
Another person who said they were briefed on the company’s plans said that Apple had originally pushed for a Summer launch.
If this person claims hold water, Apple would have been keen to stick to its annual refresh cycle of the iPhone.
However, the next-generation device wasn't ready in time, this person reportedly said.
Others, also close to Apple and / or its suppliers, said that the new iPhone is now on track for a September launch.
However, they warned that the device is more “complicated and difficult to assemble” which could cause Hon Hai Precision (Foxconn parent company) to delay the launch yet again, should it not be able to improve yield rates.
Various iPhone 5 mockups
have recently emerged
based on claims from people that said they had learned some of the particularities of Apple’s new hardware.
One of them is displayed in the images above, and it may just be the closest one to the real deal, Softpedia believes.
If Apple has ordered the production of a thinner, lighter iPhone, it will most likely look like a miniatured iPad 1, with tapering around the edges and a bulkier chassis in the center.