14 DAY TRIAL // If anything occurred over the past few months, it was the launch of a whole slew of next-generation computer parts. NVIDIA finally brought out its DirectX 11-capable GeForce GTX 400 Series of video boards, Intel showed off new mobile CPUs and Advanced Micro Devices launched its own line of six-core central processors. Of course, such events are always a queue for other hardware makers to come on stage and showcase products meant to be paired with these new components.
Knowing that summer is almost here, Xilence decided this was an opportune moment for one of its more powerful young offspring to enter the picture. Dubbed M606, the device is the hardware maker's newest CPU cooler for the high-end market segment and will make sure that heat alone won't be able to strike down chips from either AMD or Intel.
The M606 tower cooler has six heatpipes and an elaborate array of fins, whose heat is dispersed by a 120mm 2CF PWM fan. The spinner also comes with a rubber frame, for reduced noise output, and has a rotary speed of up to 1500 RPM.
All in all, this electronic should be able to handle the heat generated by even the highest end CPUs, even during the hot days of July. Unfortunately, it is unclear how large an overclocking headroom the M606 provides, though it should be significant.
Xilence's newest creation is compatible with AMD Am2/AM3-socket processors, as well as CPUs based on the LGA 775, 1156 and 1366 sockets from Intel Corp, as long as their TDP (thermal design power) does not exceed 150W. The complete package will also include thermal paste. Unfortunately, the company hasn't given any details regarding prices, so consumers will have to wait a bit longer before knowing how much cash they will eventually need to part with.