
Micron and Samsung are the biggest memory chip manufacturers in the world. Now, Micron is proud to announce that it has already
began sampling for 1 Gb DDR3 memory chips and has 2 GB chips in development.
Micron unlocks the next level of memory performance for the upcoming resource-intensive applications, providing systems with faster speeds, lower power consumption and increased memory density. The memory market leader presents the specs for the new highly-anticipated breed of memories: data rates starting from 800 megatransfers per second (MT/s) and reaching 1,600 MT/s at 800 Mhz (doubling DDR2 performances); 100,000-page documents can be transferred in as low as 1 second; memory voltage reduced from 1.8V to 1.5V and power consumption reduced by up to 30%; 78nm manufacturing process.
"Early 2007 should bring memory thirsty computing and consumer applications, such as Microsoft's anticipated Vista operating system. DDR3 will initially benefit the server, notebook, and desktop markets and will then reach consumer applications such as graphics and HDTVs," said Shane Rau, senior analyst of IDC, a market intelligence firm.
Chip samples are already available to select customers and production is expected to begin early 2007. The 1GB DDR3 components will be available in X4, X8 and X16 configurations and will fully support JEDEC DDR3 specs. Densities are expected between 512 MB and 4 GB and the memories will come in FBDIMM, UDIMM, SODIMM and RDIMM modules.
Micron also plans to introduce 2GB DDR3 devices in 1Q 2007.