14 DAY TRIAL // Looks like Qimonda, the successor of Infineon's memory business, will have its memory modules mass produced by Winbond, as they have just signed a contract regarding the future Qimonda branded memory modules.
Furthermore, the company will be using Qimonda's 80nm dynamic random access memory (DRAM) trench technology that will be transferred to Winbond's 300mm facility in Taichung, in which the future to come DRAMs for computing applications will be manufactured. "The extension of our cooperation with Winbond underlines our partnership commitment in Asia and it further increases our production capabilities and flexibility," said Kin Wah Loh, chief executive of Qimonda.
But Winbond has already signed an agreement with Infineon regarding the transfer and license of the 110nm and 90nm DRAM-technologies for Winbond's 200mm plant in Hsinchu and 300mm plant in Taichung. "Our successful collaboration with Qimonda regarding the 110nm and 90nm process technology transfers has paved the way for broadening of our partnership", said Arthur Chiao, Chairman of Winbond Electronics Corp. "The expansion of the process technology transfer to 80nm is an important step to maintain close collaboration between the two companies in the future".
Previously, Qimonda announced that it has delivered GDDR3 memory for the famous Xbox 360, the latest Microsoft development in the gaming market segment.
Qimonda representatives added that the manufacturer was selected by Microsoft as a preferred supplier of graphics RAM for the Xbox 360 video game and entertainment console from Microsoft. Consequently, Qimonda stated that it will deliver a significant share of 512Mbit GDDR3 (Graphic Double Data Rate 3) RAM for the Xbox 360 to Microsoft.
In the Xbox 360, each of the eight GDDR3 16Mbit x 32 components used operates at a rated clock speed to achieve data bandwidth of up to 44.8Gbit/s per memory device. The 512Mbit GDDR3 comes in a JEDEC compliant 136 ball FBGA package with dimensions of 11mm x 14mm x 1.2mm.