New Nano 3000 series to become available in Q3

Dec 30, 2008 16:18 GMT  ·  By

According to most recent details on the Internet, VIA Technologies is expected to update its Nano processor lineup with the addition of a new Nano 3000 Series and the Via Nano Dual Core processors. The new range of low-power CPUs are expected to provide a performance boost over the company's current Nanos. Availability is slated for late 2009, with the Nano 3000 series due to be released in Q3, whereas the dual-core version of the Nano is expected to become available in the second half of 2009.

HKEPC Hardware reports, in a recent news-article, that VIA, a leading maker of power-efficient x86 processor platforms, will be updating its Nano processor offering with the introduction of the Nano 3000 Series and the new Nano Dual Core processors. According to the available specifications, the new 3000 Series Nanos will be manufactured using the same 65nm process technology, but will provide a better overall performance.

The new processors are expected to be manufactured by the Fujtsu Foundry in Japan, with the technical specifications expected to be in line with the VIA Nano 1000/2000 series. This means support for 1333MBz V4 Bus, 64bit instruction, built-in 1MB of L2 Cache, with the addition of a new SSE4 instruction set on the new Nano 3000 series. Additionally, the new 3000 Nanos will provide improved power consumption, integer and floating-point enhancement and improved internal cache performance. The VIA Nano 3000 series will continue to use the NanoBGA 2 footprint, allowing for an easier upgrade option from current Nano processors.

Details on the new Nano Dual Core processors have also been made available, with the chip maker expected to transition the CPU architecture to a 45nm or 40nm process technology. The Nano Dual Core will be manufactured by either Fujitsu or TSMC and will also maintain the Nano BGA 2 footprint, meaning that VIA will maintain the Nano motherboard design.

 

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WenChi Chen, president and CEO of VIA Technologies
Specifications of the upcoming VIA processors
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