Having just announced its new series of Nano 3000 processors, designed specifically to meet the performance requirements of ultraportable computer enthusiasts, VIA Technologies has informed about the debut of its AMOS-5000 chassis kit. The new product has been built to meet the physical specifications of the Em-ITX form factor boards, including the company's own EITX-3000 board. The new chassis is part of the chip maker's expanding line of AMOS universal chassis products, which also includes the AMOS-1000 and the AMOS-2000 models, released back in late August.

“With the VIA AMOS-5000 we are offering developers the means to create a wealth of unique fanless designs using less time and fewer resources,” Daniel Wu, vice President, VIA Embedded Platform Division, VIA Technologies, Inc., said. “This is in keeping with our broader strategy to offer a complete and comprehensive product ecosystem that empowers our customers with a clear market advantage.”

Available now, the AMOS-5000 chassis targets a wide variety of embedded segments, including medical, healthcare, industrial and building automation, digital signage, kiosk, POI/POS, gaming and surveillance applications, according to the Taiwanese company. The modular chassis kit enables system builders to assemble robust systems that can reportedly withstand temperatures in the range of -20 degrees C to 55 degrees C.

The AMOS-5000 chassis is designed to take advantage of the integrated heatsink design found on the Em-ITX boards, for a combined solution that is meant to provide an optimum cooling efficiency and form a solid, robust base for chassis assembly. The unit can also provide support for a storage compartment, as well as a range of configurations through optional side panels that deliver support for a range of forthcoming Em-ITX I/O expansion modules, according to the company. Unfortunately, no details on pricing or availability have yet been unveiled.