A tiny motherboard is joined by an Eden processor and put inside a rugged case

May 17, 2012 20:01 GMT  ·  By

VIA has officially introduced the AMOS-3002 ultra-compact system that promises to withstand extreme temperatures, shocks and vibration.

Called VIA AMOS-3002, the new computer is to be employed in telematics, digital signage, kiosks, in-vehicle control, machine to machine controller applications and various other embedded scenarios.

In order to maximize its chances of scoring deals, VIA gave the system a sturdy case too. It also made it so that no fans are needed to keep things cool.

"The VIA AMOS-3002 advances the ultra compact AMOS series systems, delivering fanless dual core computing and advanced multimedia capabilities," said Epan Wu, head of the VIA embedded platform division, VIA Technologies, Inc.

"The superior versatility and reliable compact design of the VIA AMOS-3002 makes it ideal for a diversified range of embedded applications."

Spec-wise, there is a VIA EPIA-P900 Pico-ITX motherboard on the inside, bearing an Eden X2 dual-core processor.

This CPU has a clock speed of 1.0 GHz, which might seem low until one remembers that embedded applications don't really need much prowess in the first place.

Also, the VIA VX900H media system processor is present as well, complete with hardware acceleration for MPEG-2, WVM9 and H.264 codecs.

What's more, for connectivity and I/O, the AMOS-3002 boasts a native HDMI output, six USB ports (two lockable), a DIO port, one VGA, line-in/out, two COM ports, dual Gigabit Ethernet and optional Wi-Fi and 3G via a Mini PCI Express expansion slot.

Finally, a stronger configuration can be ordered, with a VIA EPIA-P830 motherboard and a 1.0 GHz Nano E-Series CPU.

The default AMOS-3002 is certified for -20 to 60 degrees C, vibration tolerance of up to 5Grms and a shock tolerance of up to 50G. The higher-end configuration handles -20 to 70 degrees C. Unfortunately, we can't seem to find any prices but, then again, they aren't relevant to us, consumers, anyway.

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