First computer-on-module is powered by a miniaturized 1GHz VIA Eden ULV processor

Jan 19, 2010 13:07 GMT  ·  By

VIA has used the modular design principles in the Mobile-ITX form factor, which was launched around the beginning of December 2009, to create a device capable of offering industry-leading I/O flexibility in the most compact of form factors. Known as the VIA EPIA-T700, the new computer-on-module enables the easy creation of compact and ultra-compact embedded devices in medical, military and in-vehicle applications.

"The VIA EPIA-T700 takes advantage of the modular design principles inherent in our Mobile-ITX form factor specification, making it easier than ever before to create astonishingly compact x86 devices that don’t compromise on features," Daniel Wu, vice president, VIA Embedded Platform Division, VIA Technologies, Inc., said.

The Mobile-ITX-based EPIA-T700 can be used with a variety of carrier boards, thanks to the ultra low-profile 3mm connectors. Its vibration resistance of up to 5Gs makes it well suited for in-vehicle and industrial applications.

It is powered by a special, miniaturized version of the 1GHz VIA Eden ULV processor and the compact VIA VX820 MSP. The input/output flexibility enabled by this pair is complemented by the VIA VX820 media system processor, which adds key features including the likes of the VIA Chromotion video engine with hardware acceleration of MPEG-2, MPEG-4, WMV9, and VC1 video formats. The VX820 also provides VIA Vinyl HD Audio and boasts the VIA Chrome9 DX9 integrated graphics core. The computer-on-module is equipped with 512MB of DDR2 on-board system memory and an integrated multi-configuration transmitter, which enables the display connection to TTL LCD panels and CRT monitors.

Conferring flexibility upon the VIA EPIA-T700 are the carrier board configurations, which integrate the DVP interface, thus enabling support for LVDS and DVI. The Mobil-ITX-based device even boasts integrated PCI Express and Ultra DMA data bus technologies, as well as support for an IDE channel, and up to five USB 2.0 ports.

Full information on the Mobile-ITX-based computer-on-module VIA EPIA-T700 may be found on the official product page.