Transcend Information, Inc. has yesterday released what it seems to be the world's highest capacity 200-Pin DDR2-667 Unbuffered SO-DIMM memory module. Transcend's DDR2- 667 Unbuffered SO-DIMM has a memory capacity of 2GB as it has been developed, according to the manufacturer, for speed, reliability and enhanced performance.

Transcend's 200-Pin DDR2-667 SO-DIMM memory module is said to be compatible with supported notebooks developed by all the leaders in mobile computing such as Apple, IBM, HP and Acer and, furthermore, is compatible with Intel's latest Centrino Duo mobile platform.

"Transcend's 200-Pin DDR2-667 Unbuffered SO-DIMM memory modules are engineered using original brand name DDR2 FBGA chips and our superior design results in better system stability and reliability, which means that Transcend modules are the best choice of memory module for your high-end compatible notebook. Transcend's 2GB DDR2-667 Unbuffered SO-DIMM memory chips are packed in Fine-Pitch Ball Grid Array (FBGA) chip packages for improved electrical and heat dissipation characteristics," stated Transcend representatives.

The representatives added that all Transcend memory modules come with a lifetime warranty and a global service network, which is said to provide a cost-effective solution to ensure one of the highest stability and reliability for computing systems.

Specs

-Hi-speed;
-Capacity - 200-Pin DDR2-667 Unbuffered SO-DIMM Memory Module;
-High compatibility and reliability;
-FBGA chip packages for improved electrical and heat dissipation characteristics;
-Available capacities - 256MB - 2GB;
-Lifetime warranty.