In the LSI business (Large-Scale Integration electronic integrated circuit), process technologies are shrinking to achieve high-speed, low-power system LSI for application in digital consumer products and mobile communication equipment, and products with 90nm technologies are entering volume production. To achieve further improvements in performance and power consumption, 65nm and even 45nm process technologies are now being developed.

Toshiba and NEC announced that they have agreed to collaborate on the development of CMOS logic process technology for the 45nm (nanometer) generation. Under the terms of the agreement, engineers from Toshiba and NEC Electronics will collaborate at Toshiba's Advanced Microelectronics Center in Yokohama on development of fundamental CMOS process technology, which both companies will be able to implement at their manufacturing facilities.

The achievement of 45nm system LSI will demand more development resources. In this environment, Toshiba and NEC Electronics will integrate process technologies they have developed individually, and share newly-developed technologies.

Toshiba and NEC Electronics expect the joint effort to reduce development burdens and to shorten turn-around times for highly advanced system LSI. Toshiba sees future increases in utilization rates at its most advanced system LSI production facility, while NEC Electronics expects to focus on the development of LSI products, by concentrating on differentiated process technologies.