Toshiba Corp. and Toshiba America Electronic Components, Inc. announced today the addition of an industry-leading 256GB SSD to its NAND-flash-based solid state drive lineup, along with the launch of mall-sized Flash Modules for netbook computers, ultra-mobile PCs (UMPCs) and other mobile and peripheral computer electronics. The company also announced that, for the moment, only samples of the new 256GB SSD and the Flash Modules are available, and that it plans to start mass producing the new devices in the fourth quarter of the year.

Toshiba's new 2.5-inch form factor drive is a high density SSD that offers the assets of an advanced Multi-level Cell (MLC) controller which allows it to achieve higher read and write speeds, as well as parallel data transfers. Featuring wear leveling, the new drive offers optimized performance, as well as extraordinary reliability and endurance. The launch of small Flash Modules, which support 8GB, 16GB and 32GB densities, shows the company's commitment to support the growing market for small, netbook computers, UMPCs and other personal equipment.

The new high density 256GB SSD measures only 70.6mm x 53.6mm x 3.0mm. This NAND flash memory drive is able to offer the performance levels required by mainstream notebook PCs. It is extremely reliable, features high density data storage and supports fast data transfer rates of up to 120MB per second for reading and a maximum write speed of 70MBps. The SSD comes with a SATA 3.0Gb per second interface.

The new Flash Modules announced by Toshiba are manufactured on a 50mm x 30mm platform and can provide up to 80MBps and 50MBps read and write speeds, respectively. The new devices are also compatible with the SATA interface and can be integrated into a wide range of netbook PCs, UMPCs, mobile and peripheral applications.

Toshiba also announced its determination to promoting innovations in the NAND Flash market. The company will continue enhancing its lineup with the addition of products able to offer different densities and interfaces in a range of packages, while also leveraging the performance. The newly introduced devices will be showcased at CEATEC in Makuhari, Japan, from September 30 to October 4.