It takes its name from the central processing unit that powers it

Dec 11, 2013 10:27 GMT  ·  By

Themis computer could have provably come up with a different name for its new rugged system if it really wanted to, but it must have felt that having Intel's passive endorsement would serve it best.

That said, behold the Intel Core i7 NanoPAK which, contrary to what the moniker suggests, is not a new CPU but a full computer.

In fact, it is a small form factor system that also happens to be rugged, to the point where it is good enough for military field applications.

That, at least, is what Themis claims in its press release, saying that the whole thing is small, light, efficient and well cooled.

All that in spite of using a Core i7 Ivy Bridge CPU that, no offense to Intel, is not exactly a CPU series known for its chilly state.

Then again, it's not like this is a fanless PC. There is, in fact, an external fan kit with thermally controlled impellers, complementing the internal module conduction cooling (hardened-aluminum air-cooled chassis).

Up to 8 GB of DDR3 RAM (random access memory) are part of the configuration as well, along with Flash storage built right into the system mainboard.

All in all, the newcomer, Themis NanoPAK i7, should be able to work safely at temperatures of -40° C to + 71° C.

Other specs include local or network PXE boot support and discrete data I/O lines (USB 3.0 among other things). All inside a frame of 133 x 93 x 37 mm / 5.23 x 3.66 x 1.45 inches and weighing 770 g / 1.69 pounds.

"Themis is committed to providing the highest-performance computing in the smallest form factors possible, with a focus on size, weight, power, and cooling," said Bill Kehret, president and CEO of Themis.

"The Intel Core i7 NanoPAK is a unique small form factor computer that embraces this commitment while supporting mission-critical applications."

Themis didn't give a price, because it's a matter between it and whatever customers it finds in the fields of real-time control, data recorders, small storage and communications systems and mobile robotics.