14 DAY TRIAL // Texas Instruments announced that Sagem Communication has chosen the OMAPV1030 chipset from TI's OMAP-Vox platform for its new my700X multimedia handset. Specifically designed to bring multimedia functionality to mass market mobile phones, the OMAPV1030 enables the SAGEM my700X handset to deliver the latest compelling multimedia applications for the growing EDGE market.
Optimized for cost-efficiencies and high performance, the OMAPV1030 is an integrated and optimized EDGE solution giving handset manufacturers the freedom to design affordable devices with the latest applications for the growing mid-range mobile phone market. The OMAPV1030 solution delivers advanced capabilities such as QCIF 30 frames per second video capture, playback and streaming; megapixel digital still camera; color LCD; and interactive 2D/3D gaming. Built on TI's leading OMAPTM processor architecture, the OMAPV1030 solution leverages TI's applications processing technology for smartphones to address the demand for multimedia applications in the feature phone wireless market.
The OMAP-Vox platform enables extensive modem and applications software re-use from EDGE to UMTS and across market segments, saving manufacturers' time and development costs. The OMAPV1030 processor is based on the OMAP1710 architecture and runs both GSM/GPRS/EDGE modem and applications processing on a single OMAP core, leveraging ARM926TEJ and TI DSP capabilities. This architecture serves as the foundation for the scalable OMAP-Vox hardware architecture and is designed to easily extend from 2.5G to 3G and beyond. The scalability and software re-use provided by the OMAP-Vox architecture, along with TI's DRPTM technology and process technology leadership, will enable TI to drive the OMAP-Vox family into wireless standards beyond 3G.
The Sagem my700X handset also includes TI's BRF6150, a highly integrated Bluetooth Specification v1.2 single-chip solution. The BRF6150 solution integrates TI's Bluetooth baseband, digital RF, ARM7TDMI and power management into a single chip to enhance performance, reduce cost and to minimize board space.